Solution Pathway
Deploy liquid-cooled rack environments for high-density infrastructure.
PAI supports new liquid cooling deployments by aligning cooling architecture, component sourcing, rack hardware, and deployment timelines around GPU, HPC, colocation, and other high heat-load project plans.
Deployment Model
Rack
Architecture
Density targets, rack layout, coolant path, and deployment goals.
Liquid
Cooling
Cold plates, manifolds, QDCs, CDU interfaces, hoses, and rack hardware.
Define the rack and cooling architecture
Review density targets, CDU approach, rack layout, coolant routing, and deployment goals.
Align required components
Match cold plates, manifolds, QDCs, CDU interfaces, hoses, and rack hardware to the system design.
Coordinate sourcing and lead times
Coordinate qualified component sourcing around compatibility, production timing, and delivery requirements.
What this supports
- New direct-to-chip liquid cooling deployments
- Rack-level component alignment for high-density GPU systems
- Cold plate, manifold, QDC, hose, CDU interface, and rack hardware coordination
- Deployment planning for liquid-cooled GPU, HPC, colocation, and high heat-load infrastructure
- Component compatibility support across multiple vendors
- Supply timing and deployment sequencing for project-based builds
Where PAI fits
- Help identify the required infrastructure components for the target cooling architecture
- Coordinate sourcing across qualified manufacturing partners
- Support compatibility review between rack hardware, cooling components, and deployment requirements
- Help reduce confusion between product selection, supply timing, and installation readiness
- Support projects where liquid cooling is part of a larger high-density infrastructure rollout
Planning a liquid-cooled deployment?
Submit your deployment details for PAI review, including GPU platform, rack density, cooling scope, timeline, and component requirements.