Product · Direct-to-chip cooling
Cold Plates for high-density liquid cooling systems.
Direct-to-chip thermal interfaces designed to remove heat at the source in liquid-cooled GPU, CPU, HPC, colocation, and other high-density compute environments. Cold plates sit at the core of the cooling loop, helping high-power platforms operate within demanding thermal envelopes.
Cold Plates
The heat transfer point inside the liquid cooling loop.
Cold plates are the component that makes direct-to-chip cooling possible. They sit on the processor package and transfer heat into the coolant before it returns through the rack cooling loop.
Built for direct-to-chip performance.
CDUs, manifolds, hoses, and connectors move coolant through the system. The cold plate is where thermal performance becomes real.
Where cold plates fit in the loop.
Coolant flows from the CDU through rack manifolds and server liquid routing before reaching the cold plate mounted on the processor. The cold plate transfers heat from the chip into the coolant.
Step 1
CDU
The cooling distribution unit circulates coolant and interfaces the rack loop with facility-side cooling infrastructure.
Step 2
Rack Manifold
The manifold distributes cold coolant to multiple compute nodes and collects warm return fluid across the rack.
Step 3
Server Routing
Hoses, fittings, and internal liquid routing assemblies carry coolant from the rack manifold into each server or processor assembly.
Step 4
Cold Plates
The cold plate removes heat directly from the processor package, transferring thermal energy into the coolant before it returns through the loop.
Why It Matters
Heat removed at the chip.
Cold plates remove heat directly at the GPU or CPU package, enabling higher power density and more stable liquid-cooled deployments.
Important for dense rack environments where air cooling alone cannot support the thermal load.
Typical Applications
GPU and CPU platforms.
Used in GPU servers, CPU-intensive HPC systems, OEM compute platforms, liquid-cooled racks, colocation deployments, and custom high-density infrastructure.
Often integrated with manifolds, QDCs, hoses, fittings, and CDU-side coolant distribution.
Design Focus
Thermal transfer and fit.
Cold plate selection depends on chip package, mechanical mounting, material construction, internal flow path, coolant routing, and platform integration.
PAI supports configuration alignment across cold plates, server liquid routing, manifolds, QDCs, and rack-level deployment hardware.
Deployment Fit
Matched to the system.
Cold plate requirements can change by GPU platform, CPU layout, rack density, coolant loop design, and project timeline.
Share your platform type, rack architecture, deployment volume, and target schedule so we can review configuration fit.
Technical focus areas.
Cold plates are not isolated parts. They need to match the processor package, mechanical design, fluid path, and the rest of the liquid cooling stack.
| Category | What matters | Why it matters |
|---|---|---|
| Thermal transfer | Efficient movement of heat from the chip into the coolant loop | Directly affects system cooling capability and sustained compute performance |
| Material selection | Copper or plated metal construction with reliable fluid path integrity | Supports heat transfer performance and long-term durability |
| Internal flow path | Engineered channel structure for coolant distribution | Improves heat capture and loop efficiency across the cold plate surface |
| Mechanical fit | Alignment to GPU, CPU, or custom server platform mounting requirements | Ensures deployment compatibility and easier system integration |
| System integration | Compatibility with hoses, manifolds, fittings, and quick disconnects | Supports full liquid cooling stack deployment without isolated component mismatch |
Available Configurations
Cold plate supply options.
GPU cold plates, CPU cold plates, custom OEM thermal interface designs, direct-to-chip assemblies, and program-specific geometry or connection options.
Target Environments
GPU, HPC, and colocation systems.
GPU racks, high-performance computing environments, colocation deployments, enterprise liquid cooling projects, high-density rack programs, and custom compute infrastructure builds.
Request cold plate supply for your deployment.
Pacific AI Infrastructure supports cold plate sourcing for liquid-cooled GPU, HPC, colocation, enterprise, and other high-density compute programs. Share your platform type, deployment volume, rack count, and project timeline so PAI can review configuration fit and supply alignment.