Solution Pathway
PAI supports mixed cooling environments where existing air-cooled systems, liquid-cooled racks, CDUs, manifolds, QDCs, and deployment hardware must work together during phased high-density upgrades.
Mixed Cooling Environment
Current racks, density limits, airflow constraints, and deployment conditions.
Cold plates, manifolds, QDCs, CDU interfaces, and rack-level cooling hardware.
A coordinated bridge between existing infrastructure and higher-density GPU, HPC, colocation, and other high heat-load deployments.
What this supports
Hybrid cooling projects are not just product purchases. They require planning across old and new rack environments so components match the deployment path.
Workflow
Identify which systems remain air-cooled, which racks are moving to liquid cooling, and where the main deployment constraints are.
Align cold plates, rack manifolds, CDU connections, QDCs, and required rack-level hardware around the target architecture.
Match components to project requirements, supplier lead times, installation sequence, and compatibility across the mixed environment.
Submit your project details for PAI review. We can evaluate the existing air-cooled environment, target rack density, cooling scope, timeline, and component requirements before following up.